What to expect from the CPU market in 2019?

AMD and Intel working on new “Chiplet” designs.

Processors are getting faster and faster but they are not getting that faster at the faster rate if that makes sense. The thing we are talking about is Moore’s law; which is more of an observation of trends than a law. When scaled together with Dennard scaling, gave an observation that every two years the number of transistors should double and that doubling should give us a 40% performance boost, at the same power consumption. This observation held true for many years in the history of microchips but in the last few years, the observation has gone off track. The big reason for that is to cram twice as many transistors into the same space you need to make them smaller and both Intel and AMD have struggled with this for quite a long time now.

To tackle this stagnation in the performance boost per generation both AMD and Intel have proposed their own solution. Their approaches might be different but all of their solutions revolve upon breaking up the CPU into Discrete “Chiplets” and connecting them together.

AMD’s approach to next gen of chips.

First, we don’t know everything until AMD announces its next gen of processors in the Computex event 2019. Here are what we as consumers are expecting. The CPU cores, where speed and power matter more, will be built in a 7nm while the memory controller and inputs that connect the CPU to the rest of the computer will be built at the more reliable 14/12nm architecture that AMD has been using for years. This mixed approach should increase the speed of the parts of the CPU which need to be speedy, while at the same time minimizing the number of transistors that need to be built on that new process.

While AMD looks to boost the limit of CPU performance, Intel, on the other hand, has something else to offer.

Intel’s approach to new Foverose hybrid CPUs:

Intel, for now, has been working on their own modular Chiplet design as well but targeting the low power market. They have been calling this new modular Chiplet design as Foverose. As Intel’s own explanations, these chips are a hybrid design in which the processor is split into Chiplets along with stacking multiple dies and controllers onto the chip itself. That means instead of on monolithic chip Intel is trying to produce chips with one higher power Chiplet and then multiple Atom-based lower powered Chiplets. This mixed arrangement is similar to how many mobile CPU is built. Intel has been trying to make these chips on 10nm and might be looking into the mobile processors market, mainly for laptop usage. Intel has been calling the first gen of these Foverose chips as LAKEFIELD. And it is expected to be seen in the second half of the year.

Overall 2019 is expected to be a big year in the CPU market with the new techniques to be introduced, but it remains to be seen that we experience something really great advancement in Raw CPU computation power or another show of stagnated core CPU performance as the trend has been for past few years.